High-precision infrared and hot air reflow oven for stable, even heating, ideal for lead-free soldering of single and double-sided PCB assemblies.
Features combined infrared and hot air heating technology to ensure uniform temperature distribution for high-quality, lead-free soldering.
PC connectivity allows for easy input, adjustment, and management of temperature wave data through intuitive graphical software.
Includes a built-in library of 299 solder paste data profiles, simplifying the setup for various soldering requirements.
An advanced MCU and intelligent temperature measurement technology maintain high stability and precision from room temperature up to 350°C.
Designed with a specialized rear exhaust system to maintain a safe and stable operating environment for sensitive electronic components.
User-friendly interface with a clear LCD display enables straightforward operation and monitoring of the soldering process.
Model: T-937M
Maximum Heating Area: 350x400mm
Rated Power: 3300W
Temperature Range: Room Temperature to 350°C
Process Cycle Time: 2-16 min
Control Method: 8 programmable intelligent temperature waves
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